Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Edition: 2012
Release: 2012-11-25
Publisher: Springer
Binding: Hardcover
ISBN/ASIN: 1441995412



Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. Free download Design for High Performance, Low Power, and Reliable 3D Integrated Circuits books collection in PDF, EPUB, FB2, MOBI, and TXT formats. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. Best deals ebooks download Design for High Performance, Low Power, and Reliable 3D Integrated Circuits on amazon. Design for High Performance, Low Power, and Reliable 3D Integrated Circuits with free ebook downloads available via rapidshare, mediafire, 4shared, and hotfile.

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